发明名称 THERMOSETTING RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain the subject molding material with slight burr developed when subjected to injection molding, with thin burr even if developed, ready to remove such burr, therefore having automatically finishing efficiency by compounding a thermosetting resin with each specified amount of inorganic filler and organic filler each having specific particle size differing from each other. SOLUTION: This molding material is obtained by compounding 100 pts.wt. of a thermosetting resin (e.g. novolak-type phenolic resin) with 10-50 pts.wt. of an inorganic filler 150-500μm in particle size (e.g. of alumina, aluminum hydroxide, talc, clay, mica) and 20-100 pts.wt. of an organic filler 5-100μm in particle size (e.g. woodmeal, pulp powder, plywood powder).
申请公布号 JP2000086910(A) 申请公布日期 2000.03.28
申请号 JP19980264452 申请日期 1998.09.18
申请人 SUMITOMO BAKELITE CO LTD 发明人 SUZUKI TAKAYUKI;YAMASHITA CHITOSHI
分类号 C08K7/00;C08L61/06;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08K7/00
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