| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. for semiconductor sealing applicable to insert installation and surface installation and excellent in room temp. storage character and rapid curing. SOLUTION: This compsn. contains as essential components, an epoxy resin, a phenol resin, a cure promoter which is prepared by reacting tetraphenyl phosphonium tetraphenyl borate (X) with a compd. having 2 phenolic hydroxyl group in a mol. (Y) at a mol. ratio of X:Y=1:2-1:4, then further reflux reacting with an alcoholic solvent, and an inorg. filler, and the equivalent ratio of epoxy group of total epoxy resin to phenolic hydroxyl group of total phenol resin is 0.5-2, and the compounding quantity of the inorg. filler is 200-2400 pts.wt. to 100 pts.wt. of total of the total epoxy resin and total phenol resin.
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