发明名称 |
Adhesive sheet for wafer setting and process for producing electronic component |
摘要 |
An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part, wherein the marginal part has an antiexpansibility greater than that of the wafer setting part. This enables secure expansion in a process for producing an electronic component.
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申请公布号 |
US6042922(A) |
申请公布日期 |
2000.03.28 |
申请号 |
US19980028147 |
申请日期 |
1998.02.23 |
申请人 |
LINTEC CORPORATION |
发明人 |
SENOO, HIDEO;SUGINO, TAKASHI;NODE, SHUNSAKU |
分类号 |
C09J7/02;C09J201/00;H01L21/301;H01L21/58;(IPC1-7):B32B3/02 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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