发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
摘要 PROBLEM TO BE SOLVED: To improve high temperature shelf stability of an epoxy resin composition comprising a biphenyl type epoxy resin and to attain high flame retardancy without using conventional flame retardants, that is, a halogen compound- containing flame retardant and an antimony compound. SOLUTION: This composition comprises (1) 0-30 pts.wt., based on 100 pts.wt. of a biphenyl type epoxy resin, of either a terpene type epoxy resin or a cresol novolak type epoxy resin, (2) 0-30 pts.wt., based on 100 pts.wt. of a xylok type phenol resin, of either a terpene type phenol resin or a phenol novolak type resin, (3) an amino group-containing polyether-modified polysiloxane compound, a silicone compound, as a flame retardant and (4) at least 87 wt.%, based on the whole composition, of fused silica as an inorganic filler, whereby the composition can attain a glass transition temperature of at least 150 deg.C and the V-0 class of the flame retardancy standard (UL 94) and exhibit an improved high temperature shelf stability.
申请公布号 JP2000086868(A) 申请公布日期 2000.03.28
申请号 JP19980262527 申请日期 1998.09.17
申请人 MITSUBISHI ELECTRIC CORP;SHIN ETSU CHEM CO LTD 发明人 AKA FUMIAKI;ASANO HIDEKAZU
分类号 C08K3/36;C08G59/24;C08G59/32;C08G59/62;C08G59/68;C08L63/00;C08L83/12;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/36
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