| 摘要 |
PROBLEM TO BE SOLVED: To obtain a setting organic resin composition comprising a setting organic resin and silicon atom-containing compound obtained by binding a specific group with the silicon atom, and capable of forming a setting resin excellent in fluidity before setting and superior in cohesion and adhesion properties after setting. SOLUTION: This composition comprises at least (A) 100 pts.wt. of setting resin (pref. an epoxy resin, imide resin or phenol resin), and (B) 0.01 to 100 pts.wt. of silicon atom-containing compound obtained by binding a group of formula I [R1 is H, a (substituted) univalent hydrocarbon or silyl; and R2 is a >=2C (substituted) alkylene] with the silicon atom, wherein the compound is pref. shown by formula II [R3 is H, a (substituted) univalent hydrocarbon or alkoxy; and (a) and (b) satisfy the equations of 0<a<=1, 1<=b<=2, and 3<2a+b<=4].
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