发明名称 |
Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
摘要 |
A method and apparatus for selectively heating a structure (20) capable of absorbing heat radiations in the 0.5 to 2 micron range relative to an adjacent structure (24) wherein a first structure capable of absorbing heat radiations in the 0.5 to 2 micron range is disposed adjacent a second structure much less capable of absorbing heat radiations in the 0.5 to 2 micron range. An unfocused heat source (28) which provides a major portion of its heat energy in the range of from about 0.5 mu to about 2 mu relative to heat energy above 2 mu and below 0.5 micron directs heat concurrently to the first and second structures to heat the first structure to a temperature sufficiently high and much higher then the second structure to permit a predetermined function to be performed in conjunction with the first structure while maintaining the second structure below a predetermined temperature. The function is then performed. The heat source preferably comprises an unfocused tungsten halogen lamp. |
申请公布号 |
US6041994(A) |
申请公布日期 |
2000.03.28 |
申请号 |
US19970991751 |
申请日期 |
1997.12.16 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HWANG, MING;AMADOR, GONZALO;WANG, LOBO |
分类号 |
H01L21/00;H01L21/60;(IPC1-7):B23K37/00;B23K31/02;H05B1/00;H05B3/10 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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