| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device capable of measuring an outline, a flaw, and a chip of a wafer on a machine. SOLUTION: A subsequent measuring device 48 for measuring a flaw, etc., on a chamfered surface and an outline of a wafer W by image processing is incorporated on a device body. The subsequent measuring device 48 measures a flaw, etc., and an outline of the chamfered wafer W.A good wafer W is collected in a wafer cassette 30 and a defective wafer WX is recovered in a defective wafer recovery cassette 124.
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