发明名称 POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a composition capable of giving a cured product having high adhesive strength to an epoxy resin and a small dispersion of such strength by selecting a composition comprising a polyphenylene sulfide resin, a glass fiber and a filler except a glass fiber and having a specified or larger spiral flow length and a specified heating loss. SOLUTION: This composition is one comprising 100 pts.wt. polyphenylene sulfide resin, 5-300 pts.wt. coupling-agent-treated glass fiber having an average fiber diameter of 3-15μm, and 5-300 pts.wt. inorganic filler (e.g. talc or mica) except a glass fiber and having a spiral flow length of 120 mm or above and a heating loss of 0.3-2.0 wt.%. If necessary, it may further be formulated with 0-50 pts.wt. thermoplastic resin having ester linkages, ether linkages, amino linkages, or the like and the like. The polyphenylene sulfide resin is a mixture comprising 10-100 wt.% one having a content of chloroform extractibles of 1.0 wt.% and an MFR of 1,000 g/10 min and 0-90 wt.% one having a content of chloroform extractibles of 0.3 wt.% or below and an MFR of 250 g/10 min or above.
申请公布号 JP2000086892(A) 申请公布日期 2000.03.28
申请号 JP19980255819 申请日期 1998.09.09
申请人 TORAY IND INC 发明人 SUZUKI SHIGEMITSU;KOMINAMI KAZUHIKO;KOBAYASHI HIROKAZU
分类号 C08K3/00;C08K7/14;C08L81/02;C08L81/04;(IPC1-7):C08L81/04 主分类号 C08K3/00
代理机构 代理人
主权项
地址