发明名称 THERMALLY POLYMERIZABLE COMPOSITION AND ITS USE
摘要 PROBLEM TO BE SOLVED: To obtain a practicable and thermally polymerizable composition good in hardening properties, and excellent in preservation stability by including a thermally polymerizable compound, an electrolyte salt, a polymerization initiator and a polymerization inhibitor. SOLUTION: The objective composition comprises (A) at least one kind of a thermally polymerizable compound capable of providing a polymer having a cross-linked and/or side-chain type structure by polymerizing the compound, (B) at least one kind of an electrolyte salt, (C) at least one kind of a polymerization initiator, and (D) at least one kind of a polymerization inhibitor having a vinyl group. The component D is preferably a compound having a structure of formula I [A is an alkylene; Ph is a (substituted) phenyl; and is 0 or 1]. The component C is preferably an organic peroxide of formula II [X is an alkyl or an alkoxy; Y is an alkyl; and (m) and (n) are each 0 or 1], (preferably diacyl peroxides containing no benzene ring).
申请公布号 JP2000086711(A) 申请公布日期 2000.03.28
申请号 JP19980263203 申请日期 1998.09.17
申请人 SHOWA DENKO KK 发明人 TAKEUCHI MASATAKA;UCHIJIYOU SHIYUUICHI
分类号 H01G9/025;C08F2/40;C08F2/44;C08F20/10;C08K3/10;C08K5/19;H01B1/06;H01G11/14;H01G11/22;H01G11/38;H01G11/44;H01G11/56;H01G11/64;H01G11/84;H01G11/86;H01M6/18;H01M10/05;H01M10/052;H01M10/0565;H01M10/058 主分类号 H01G9/025
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