| 摘要 |
PROBLEM TO BE SOLVED: To provide a mirror surface polishing method capable of almost perfectly preventing the degradation of TTV of a wafer by oscillating the wafer in the optional direction after it is oscillated in figure-8-shape on a polishing pad. SOLUTION: In the process of rotational pressing, wafers W held by carriers 1-1, 1-2 are pressed on a polishing pad 3 of a rotary lower surface plate 2 while they are rotated. In the process of preoscillation, the wafers W are oscillated in figure-8-shape along the Y axis direction of the polishing pad 3. Thereafter, the wafers are oscillated in elliptical shape in the area of the polishing pad 3 which is in contact with the wafers W in the process of preoscillation. |
