ULTRAVIOLET-CURING TYPE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain an ultraviolet-curing type resin composition capable of realizing ultrahigh moisture resistance in airtight sealing of an element having low resistance to heat such as a photoelectric element or a light emitting element. SOLUTION: This ultraviolet-curing type resin composition is obtained by compounding (a) an epoxy compound having two or more epoxy groups in one molecule with (b) a photocationic curing initiator and (c) at least one inorganic filler selected from the group of a platy inorganic filler and a scaly inorganic filler as essential components. The amount of the compounded inorganic filler (c) is >=20 wt.% in the resin composition.