| 摘要 |
PROBLEM TO BE SOLVED: To conduct firing at a low temperature and to form a smooth and bubble-free dielectric glass layer by mixing the specified amts. of the medium-m. p. glass powder and low-m.p. glass powder having specified thermal expansion coefficient and softening point, respectively. SOLUTION: The medxum-m.p. glass has 70-90×10-7 deg.C thermal expansion coefficient and 450-530 deg.C softening point, and the low-m.p. glass has 100-130×10-7/ deg.C thermal expansion coefficient and 340-400 deg.C softening point. The glass composition is obtained by mixing 70-90 wt.% medium-m.p. glass powder and 30-5 wt.% low-m.p. glass powder. The medium-m.p. glass contains, by weight, 40-75% PbO, 5-30% B2O3, 3-15% SiO2 and 0-25% ZnO, and the low-m. p. glass contains 8-90% PbO, 10-16% B2O3, 0.1-5% SiO2 and 0-5% Al2O3.
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