| 摘要 |
PURPOSE:To make possible junction with a pitch narrower than that of junction with only an anisotropic conductive film and achieve connection with a small resistance value and small floating capacitance by laying semiconductor elements one over the other in such a manner as being electrically connected together via the conductive members of an electrical connecting member and the conductive particles of an anisotropic conductive film. CONSTITUTION:An electrical connecting member 1 has plural gold conductive members 102 electrically insulated from one another and held in a holder 101 made of polyimide and one end 103 of each of the conductive members 102 is exposed on the semiconductor element 300 side and the other end 104 on the circuit substrate 300 side. One face of an anisotropic conductive film 2 is exposed on the other end 104 side of each of the conductive members 102 of the connecting member 1 and the other face on the circuit substrate 300 side. The recessed connecting portion 202 of the Al of the semiconductor element 200 is electrically connected to one exposed end 103 of each of the conductive members 102 of the connecting member 1 and one end 104 of each of the conductive members 102 of the connecting member 1 which end is exposed on the conductive film 2 side is electrically connected to metal particles 4 dispersed in the electrically insulating adhesive 3 of the anisotropic conductive film 2 and the metal particles 4 are electrically connected to a connecting portion 301 of gold-plated copper pattern of the circuit substrate 300. |
