MULTI-LAYER CIRCUIT HAVING A VIA MATRIX INTERLAYER CONNECTION AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: Multi-layer circuit is to solve thermal distortion of a flexible film, registration between the circuit metallizations and metallized vias and reliable connections between flexible circuit layers. CONSTITUTION: An interlayer connection for electrically connecting first and second conductive elements and reducing interlayer registration requirements is disclosed. The interlayer connection includes a first layer including a first electrically conductive element, a second layer including a second electrically conductive element, and a third layer disposed between the first layer and the second layer. The third layer includes an electrically insulative portion having a matrix of immediately adjacent vias therethrough. A selected plurality of immediately adjacent vias within the matrix are disposed between the first and the second electrically conductive elements and contain electrically conductive material forming a conductive path between the first and the second electrically conductive elements.