| 摘要 |
PURPOSE: A semiconductor package is provided to ensure the dimensional accuracy between a hole and an external terminal by using a positioning hole. CONSTITUTION: The semiconductor package (11) has a substrate (12) which is mounted with a semiconductor chip on one surface and numerous external terminals (14) arranged at prescribed pitches on the other surface. Positioning holes (13) are formed at two or more desired locations of the substrate (12) so as to ensure the dimensional accuracy between the holes and one arbitrary external terminal (14a).
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