| 摘要 |
PURPOSE: A wafer transfer apparatus is provided to conduct an exact die bonding at a die boding process by determining a position of a wafer to a reference position adjusting a position of a division line into a rotation direction and into a length and breadth direction. CONSTITUTION: The wafer transfer apparatus comprises a location determining unit (400), a transfer tape mounting unit (600) and a protection tape flaking unit (800). The location determining unit (400) positions a protection tape-attached wafer to a position determining table, and adjusts a position of the wafer into a rotation direction and into a length and breadth direction to determine the position of the wafer to a reference position. The transfer tape mounting unit (600) positions the wafer thus determined to a transfer tape mounting table, and attaches a transfer tape to a ring frame and a wafer surface at the same time so as to be unified with the ring frame. The protection tape flaking unit (800) positions the wafer thus unified to a protection tape flaking table, attaches one end of a flaking tape to one end of the protection tape of a wafer surface side, and flakes the protection tape from the wafer surface by drawing the flaking tape. |
