| 摘要 |
PURPOSE: A semiconductor integrated circuit apparatus is provided, which arranges a peripheral circuit and a bonding pad in a center portion of a semiconductor chip and compresses a power voltage to provided the peripheral circuit. CONSTITUTION: The semiconductor integrated circuit apparatus comprises: a wire channel to be formed in the center, having a data input/output circuit, a boding pad series, and a wire layer; a power circuit to be installed in the center, having an input/output interface circuit, and a boosting circuit or a compressing circuit; a redundancy circuit to be installed in the center; a wire channel to be formed at formed portion of the redundancy circuit and an expanding layer for forming a stable capacitance in the center of the semiconductor chip. Thereby, it is possible to secure the stability of the inner power voltage. |
