发明名称 |
METHOD FOR MANUFACTURING A CARRIER ELEMENT FOR SEMICONDUCTOR CHIPS |
摘要 |
PURPOSE: A carrier element fabrication method used for semiconductor chip in particular for mounting in chip cards is disclosed. CONSTITUTION: The carrier element for a semiconductor chip (23), in particular for mounting in chip cards, has a substrate (15) that carries the chip (23) and a reinforcing foil (10) laminated on the side of the substrate (15) that carries the chip (23). The reinforcing foil (10) has a recess (14) for receiving the chip (23) and its connection lines (24), whose edge is provided with a frame (12) that forms a single piece with the foil (10). |
申请公布号 |
KR20000016639(A) |
申请公布日期 |
2000.03.25 |
申请号 |
KR19987010238 |
申请日期 |
1998.12.14 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HUBER, MICHAEL;STAMPKA, PETER;HOUDEAU, DETLEF;FISCHER, JORGEN;HEITZER, JOSEF;GRAF, HELMUT |
分类号 |
H01L23/16;H01L23/24;H01L23/498 |
主分类号 |
H01L23/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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