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发明名称
Verfahren zur Einebnung einer Halbleitereinrichtung
摘要
申请公布号
DE19648082(C2)
申请公布日期
2000.03.23
申请号
DE1996148082
申请日期
1996.11.20
申请人
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
发明人
PARK, IN-OK;CHUNG, YUNG-SEOK;KIM, EUI-SIK
分类号
H01L21/31;H01L21/3105;H01L21/316;H01L21/3205;H01L21/768;H01L23/522;(IPC1-7):H01L21/316;H01L21/310;H01L21/324
主分类号
H01L21/31
代理机构
代理人
主权项
地址
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