发明名称 |
Improving wet etching uniformity during spin-etching of a layer on a semiconductor wafer, by forming a water film on the wafer before acid etching of the layer |
摘要 |
Wet etching uniformity is improved by forming a water film on a layer-bearing semiconductor wafer (10) before acid etching of the layer. An Independent claim is also included for a wet etching process comprising: application of deionized water onto a rotating layer-bearing semiconductor wafer (10) to form an aqueous film and application of an acid solution (40) to etch the layer before the water film dries. Preferred Features: The layer is a metallic layer (e.g. of copper or aluminum) or a non-metallic layer (e.g. silicon, silicon oxide, borophosphosilicate glass (BPSG), phosphosilicate glass (PSG), borosilicate glass (BSG). silicon nitride, silicon oxynitride or spin-on glass). The acid solution contains sulfuric, hydrofluoric, nitric, phosphoric and/or acetic acids.
|
申请公布号 |
DE19850838(A1) |
申请公布日期 |
2000.03.23 |
申请号 |
DE19981050838 |
申请日期 |
1998.11.04 |
申请人 |
MOSEL VITELIC INC., HSINCHU;PROMOS TECHNOLOGIES, INC.;SIEMENS AG |
发明人 |
LIN, WEI-CHIH;KAO, MING-SHENG;KUNG, MING-LI;LIN, CHIH-MING |
分类号 |
H01L21/311;H01L21/3213;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/311 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|