发明名称 AN IMPROVED METHOD AND APPARATUS FOR TRANSFERRING SIGNALS THROUGH A HIGH DENSITY, LOW PROFILE, ARRAY TYPE STACKING CONNECTOR
摘要 An apparatus for transferring signals through a stacking connector includes a first engaging contact member (110) mounted on a first circuit board (160) and a second engaging contact member (115) on a second circuit board (170). The first engaging contact member is electrically coupled to a first signal line (165) on the first circuit board and the second engaging contact member is electrically coupled to a second signal line (175) on the second circuit board. A conductive barrier (105) partially surrounds the second engaging contact member. The barrier is connected to a bias or ground voltage line (182) via a spring contact member (186).
申请公布号 WO0016444(A1) 申请公布日期 2000.03.23
申请号 WO1999US20551 申请日期 1999.09.07
申请人 INTEL CORPORATION;TURNER, LEONARD, O. 发明人 TURNER, LEONARD, O.
分类号 H01R12/04;H01R13/646;(IPC1-7):H01R9/09 主分类号 H01R12/04
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