发明名称 |
AN IMPROVED METHOD AND APPARATUS FOR TRANSFERRING SIGNALS THROUGH A HIGH DENSITY, LOW PROFILE, ARRAY TYPE STACKING CONNECTOR |
摘要 |
An apparatus for transferring signals through a stacking connector includes a first engaging contact member (110) mounted on a first circuit board (160) and a second engaging contact member (115) on a second circuit board (170). The first engaging contact member is electrically coupled to a first signal line (165) on the first circuit board and the second engaging contact member is electrically coupled to a second signal line (175) on the second circuit board. A conductive barrier (105) partially surrounds the second engaging contact member. The barrier is connected to a bias or ground voltage line (182) via a spring contact member (186). |
申请公布号 |
WO0016444(A1) |
申请公布日期 |
2000.03.23 |
申请号 |
WO1999US20551 |
申请日期 |
1999.09.07 |
申请人 |
INTEL CORPORATION;TURNER, LEONARD, O. |
发明人 |
TURNER, LEONARD, O. |
分类号 |
H01R12/04;H01R13/646;(IPC1-7):H01R9/09 |
主分类号 |
H01R12/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|