VORRICHTUNG ZUM ABRICHTEN EINES POLIERKISSEN

摘要

A conditioning end effector apparatus (10) for conditioning a CMP polish pad (40) includes an end effector (20) for contacting CMP polish pad (40). Holder mechanism (12) includes end effector recess (18) for receiving end effector (20) . Spacer mechanism (22 or 22') is also located at predetermined locations in end effector recess (18) to associate with end effector openings (26) in end effector (20) . End effector (20) firmly attaches through spacer mechanism (22 or 22') to holder mechanism (12) using a fastening device (24). Because of spacer mechanism (22 or 22'), end effector (20) is at distance from recess face (36) to permit slurry (38) that is deposited on CMP polish pad (40) to pass through end effector openings (26).