| 摘要 |
<p>The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components (22) using an enclosable single vessel (20). The methods of the present invention include contacting the electronic components (22) with an activation solution followed by contacting the electronic components (22) with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.</p> |
