发明名称 |
Method of manufacturing a plurality of semiconductor bodies |
摘要 |
Semiconductor chips are produced by depositing identical semiconductor layer sequences (18) onto the wafer surface exposed by windows in a patterned masking layer (4) and then separating the wafer between the structures to produce individual chips. |
申请公布号 |
EP0903792(A3) |
申请公布日期 |
2000.03.22 |
申请号 |
EP19980117796 |
申请日期 |
1998.09.18 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HAERLE, VOLKER, DR. |
分类号 |
H01L21/205;H01L33/00;H01S5/02 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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