发明名称 REFRIGERATING PLANT
摘要 <p>A compressor (2), a heat releasing element (3A) of a heat exchanger (3) for heating, an electromotive expansion valve (4), and a heat absorbing element (5A) of a heat exchanger (5) for cooling are connected to each other to constitute a primary refrigerant circuit. A pump (11), a heat absorbing element (3B) of the heat exchanger (3) for heating, a first indoor heat exchanger (12), an electromotive expansion valve (13), a second indoor heat exchanger (14), and a heat releasing element (5B) of the heat exchanger (5) for cooling are connected to each other to compose a secondary refrigerant circuit (10). A liquid refrigerant ejected from the pump (11) is evaporated in the heat absorbing element (3B) of the heat exchanger (3) for heating, reduced in pressure by the electromotive expansion valve (13), and evaporated in the second indoor heat exchanger (14). Thereafter, the gas refrigerant is condensed in the heat releasing element (5B) of the heat exchanger (5) for heating to be returned to the pump (11). &lt;IMAGE&gt;</p>
申请公布号 EP0987503(A1) 申请公布日期 2000.03.22
申请号 EP19990901197 申请日期 1999.01.29
申请人 DAIKIN INDUSTRIES, LTD. 发明人 HORI, YASUSHI;SADA, SHINRI
分类号 F25B1/00;F25B25/00;F25B29/00;F25D17/02;(IPC1-7):F24F5/00 主分类号 F25B1/00
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