| 摘要 |
PROBLEM TO BE SOLVED: To provide a light transmitter-receiver system permitting to package optical parts and electronic parts therein at a high density and a high efficiency in the case the optical parts and the electronic parts are mixed and mounted on the same substrate. SOLUTION: A pair of surface type light emitting and receiving elements 12a, 12b are mounted facedown on a multi-layered substrate 10 by using flip chip joining method, and through-holes 14a, 14b are formed right under the centers of the surface type light emitting and receiving elements 12a, 12b, respectively. Clad parts of a conductive layer with plating on the surface are formed on the inner walls of the through-holes 14a, 14b, and core parts are formed of a polymer resin in the middle parts. On the bottom side of the multi-layered substrate 10 an optical wave guide 22 is formed, which extends straight from right under one through-hole 14a up to right under the other through-hole 14b. 45 deg. micro mirrors 28a, 28b are formed at both end parts of this optical waveguide 22. |
