| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive composition utilized for a polishing treatment to give mirror finish to a surface of a plate body such as a silicon wafer and the like for which extremely high flatness and parallel are required, particularly the abrasive composition which shows less contamination by heavy metals and gives excellent rapidness of processing and excellent smoothness of the finished surface. SOLUTION: This abrasive composition comprises a solution having a buffer effect which is obtained by adding an alkali component and an acidic component to a colloidal dispersion of a silicon oxide fine particle. The alkali component is a quaternary ammonium having not more tan 12 carbon atoms and the acidic component is at least one inorganic acid selected from carbonc acid, silicic acid and boric acid. The silicon oxide as an abrasive particle has an average particle diameter of 5 nm-500 nm and the concentration thereof is 1-15 wt.% of the abrasive composition. Four substituting groups composing the quaternary ammonium are each either one of alkyl groups including methyl, ethyl, propyl and butyl or hydroxylethyl group.
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