发明名称 Polishing method, abrasive material, and polishing apparatus
摘要 Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.
申请公布号 US6039631(A) 申请公布日期 2000.03.21
申请号 US19980065444 申请日期 1998.04.24
申请人 SONY CORPORATION 发明人 SATO, SHUZO;OHTORII, HIIZU
分类号 B24B29/00;B24B13/02;B24B37/04;B24D3/28;B24D3/34;B24D11/02;B29C44/12;(IPC1-7):B24B1/00;B24B7/00;B24B33/00 主分类号 B24B29/00
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