| 摘要 |
PROBLEM TO BE SOLVED: To make uniform the cooling surface temperature through simple structure by immersing a high thermal conductivity granular part into cooling fluid in a channel. SOLUTION: An outer container 3, a channel 4 and a granular member 5 constitute a heat sink 20. Contact faces 3a, 3b with a flat semiconductor element are formed on the outer surface of the outer container 3 incorporating a cavity- like cooling fluid channel 4 having an inlet 4a and an outlet 4b on the opposite sides. High thermal conductivity granular members 5 composed of copper grains, or the like, are then immersed into cooling fluid in the channel 4. Since the cooling fluid enters from the inlet 4a of the channel 4 and flows toward the outlet 4b while snaking through the gaps of multiple granular members 5 in the channel 4, a three-dimensional flow of cooling fluid is established in the channel 4 and the temperature in the channel 4 can be made uniform. Consequently, heat exchange efficiency is enhanced resulting in the enhancement of cooling.
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