发明名称 MOLD FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold for injection molding which can be cooled even in a place where a passage through which the cooling water of the mold is passed can hardly be formed and does not require the use of a material of high heat conductivity the rigidity of which is reduced. SOLUTION: In a mold in which a fixed side mold and a movable side mold 2 are installed, a cavity is formed between the fixed side mold and the movable side mold 2, the base part 231 of one end side of a cavity insert-shaped core 23 is fitted to the movable mold 2, the other end side 232 of the core 23 is protruded into the cavity, a Peltier element 4 is installed in the base part 231 of the core 23, the core 23 is cooled by the Peltier element 4, piping 24 for cooling water is formed near the base part 231 of the core 23 of the movable side mold 2 to which the base part 231 of the core 23 is fitted, and heat from the Peltier element 4 is absorbed by the cooling water in the piping 24.
申请公布号 JP2000079630(A) 申请公布日期 2000.03.21
申请号 JP19980252770 申请日期 1998.09.07
申请人 SEKISUI CHEM CO LTD 发明人 IZUMI RYUICHI
分类号 B22D17/22;B29C33/02;B29C45/37;B29C45/73;(IPC1-7):B29C45/73 主分类号 B22D17/22
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