| 摘要 |
PROBLEM TO BE SOLVED: To form a laminated substrate from which curvature is reduced even when either one of paired substrates is curved so that its bonding surface may become a protruding surface or recessed surface. SOLUTION: Semiconductor substrates 11 and 12 are successively bonded together from one parts by fixing the substrate 11 in a flat state when the bonding surface 11a of the substrate 11 is protruding or fixing the flat substrate 12 in a flat state when the bonding surface 11a is protruding. When the bonding surface 11a is protruding, such forces that work to protrude the bonding surfaces 11a and 12a of the substrates 11 and 12 are applied and, when the surface 11a is a protruding surface, such forces that work to protrude the bonding surface 11a are applied. In either cases, the forces offset each other.
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