发明名称 Lapping tape
摘要 Described is a lapping tape having, on a flexible substrate, a lapping layer formed by coating a paint for the formation of a lapping layer which contains inorganic powders, a binder and solvents, and then drying. In the lapping tape according to the present invention, the solvents in the paint contain an organic solvent having a boiling point of 120 DEG C. or higher in an amount of 20 to 60 wt. % based on the total amount of organic solvents; the lapping layer has a thickness of 3 to 25 mu m; and the remaining amount of the solvents in the lapping layer is 500 g/m3. The present invention therefore brings about excellent advantages that the lapping scratches on the surface to the lapped can be prevented to the utmost; peeling of the lapping layer from the lapping tape can be suppressed; and the lapping tape has excellent lapping ability.
申请公布号 US6040034(A) 申请公布日期 2000.03.21
申请号 US19980064312 申请日期 1998.04.23
申请人 TDK CORPORATION 发明人 OKADA, KESAO;KUROSE, SHIGEO
分类号 B24B21/00;B24D3/34;B24D11/00;G11B5/187;G11B5/41;G11B5/84;(IPC1-7):D06N7/04 主分类号 B24B21/00
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