摘要 |
Disclosed is a jack assembly and a jack assembly panel system for use in telecommunications equipment, as well as a method for manufacturing both. The jack assembly is a one-piece, single-molded jack assembly and the method for making the jack assembly involves placing the switch assemblies into the mold cavity and molding the framework with the switch assemblies in it. The jack assembly panel consists of numerous molded components which can be substantially snapped together for ease of assembly and resulting in a significant reduction in the number of assembly steps.
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