发明名称 Method for assembling a jack assembly panel
摘要 Disclosed is a jack assembly and a jack assembly panel system for use in telecommunications equipment, as well as a method for manufacturing both. The jack assembly is a one-piece, single-molded jack assembly and the method for making the jack assembly involves placing the switch assemblies into the mold cavity and molding the framework with the switch assemblies in it. The jack assembly panel consists of numerous molded components which can be substantially snapped together for ease of assembly and resulting in a significant reduction in the number of assembly steps.
申请公布号 US6038766(A) 申请公布日期 2000.03.21
申请号 US19990345608 申请日期 1999.06.28
申请人 TELECT, INC. 发明人 WERNER, WILLIAM R.
分类号 H01R13/514;H01R24/58;H04Q1/14;(IPC1-7):H01R43/20 主分类号 H01R13/514
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