| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component, in which the electronic component obtained by punching a film carrier can be mounted, with high accuracy and with good operability, on a board such as a display panel or the like. SOLUTION: A lower mold 42 in which a through hole 43 is formed and a punch 50 which punches a film carrier 1A by being moved up and down inside the through hole 43 constitute a punching device 40 which is provided at an electronic-component mounting apparatus for a display panel 60. In addition, a first nozzle 13 in the lower part of the through hole 43 and by which an electronic component 7 obtained by being punched by the punch 50 is vacuum-sucked and received at the lower part so as to be delivered to a second nozzle 54 is installed. Consequently, the electronic component 7 which is obtained by punching the film carrier 1A is received by the first nozzle 13 so as to be delivered to the second nozzle 54, and it can be mounted surely on display panel 60.
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