| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily form an insulation film having a good insulation characteristic to a necessary shape by coating an insulative material solution in which a predetermined organic compound is dispersed or dissolved in a liquid insulative material by a printing process and baking it. SOLUTION: A viscous liquid organic compound 13 in a state of a solid or a liquid polymer at an ordinary temperature such as acetamide and acetotoluide is dispersed or dissolved in a liquid insulative material 14 capable of forming a film by baking. The organic compound 13 is evaporated from the insulation film 12 during baking by preferably using the organic compound 13 having a boiling point of 50 to 300 deg.C, lower than temperature for baking the insulation film to obtain a fine and uniform insulation film 12 without causing a pin hole and a gap. The viscous organic compound 13 is mixed to the liquid insulative material 14 to import an appropriate viscosity. Thereby, the insulation film 12 can be easily and accurately formed into a necessary pattern by coating the liquid on a substrate 11 consisting of silicate glass, etc., by an offset printing process and the substrate 11 having a large area can be obtained.</p> |
