发明名称 |
Method for electroplating using stabilized dispersions of conductive particles |
摘要 |
The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic-lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
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申请公布号 |
US6039859(A) |
申请公布日期 |
2000.03.21 |
申请号 |
US19980082437 |
申请日期 |
1998.05.20 |
申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
SONNENBERG, WADE;HOULE, PATRICK J.;LUONG, THONG B.;SHELNUT, JAMES G.;FISHER, GORDON |
分类号 |
H01B1/24;H05K3/42;(IPC1-7):C25D5/02;C25D5/54 |
主分类号 |
H01B1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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