发明名称 |
Semiconductor device with moisture resistant fuse portion |
摘要 |
On a semiconductor substrate, a first circuit and a second circuit are provided with a space therebetween. The first circuit and the second circuit are connected to each other by a fuse portion. In the middle of the fuse portion, a connecting portion is interposed, which is made of a material highly resistant to corrosion. Accordingly, an improved semiconductor device with a corrosion-resisting fuse portion is accomplished, which ensures the layout to be designed much more freely.
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申请公布号 |
US6040615(A) |
申请公布日期 |
2000.03.21 |
申请号 |
US19980059280 |
申请日期 |
1998.04.14 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NAGAI, YUKIHIRO;MAMETANI, TOMOHARU |
分类号 |
H01L21/82;H01L23/525;H01L27/118;(IPC1-7):H01L29/00;H01L23/58;H01L23/62 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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