| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a heat sink, which makes a stable installation of a heat sink possible and allows bypass capacitors to be effectively disposed for an integrated circuit package. SOLUTION: A method for mounting a heat sink includes an integrated circuit package 1 mounted on one face of a printed wiring board 2, a heat sink 3 on the integrated circuit package 1, and a plate 4 which is on the other face of the printed wiring board 2 which is to be screwed with the heat sink 1 so as to hold the printed board 2 in between with the heat sink 1. The plate 4 is constituted of projecting sections 4a formed with screw holes 4b and a frame section 4c which stays back inward from the projecting sections 4a. In a space on the printed wiring board 2 demarcated by the frame sections' staying back from the projecting sections 4a, many bypass capacitors are mounted close to the integrated circuit package 1.
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