| 摘要 |
PROBLEM TO BE SOLVED: To realize high density mounting onto a substrate and connection reliability simultaneously by providing external terminals for a flat surface on the bottom of a surface mount part and providing L-shaped external terminals across the bottom and the side of the surface mount part. SOLUTION: A large number of external terminals for a flat surface, i.e., lower surface electrodes 11, are arranged in matrix on the bottom 10a of an SMD 10. Furthermore, L-shaped external terminals, i.e., lower surface side electrodes 12, are arranged across the bottom 10a and the side 10b of the surface mount part. Since the lower surface electrode 11 employs a BGA, for example, a large number of electrodes can be arranged on the bottom and high density mounting is realized. Since the lower surface side electrode 12 employs a J-bend terminal, for example, contact area with a board is increased and bonding strength to the board is enhanced resulting in the enhancement of connection reliability. Furthermore, the signal line can be shortened while realizing high density mounting. |
