| 摘要 |
PROBLEM TO BE SOLVED: To surely avoid a break in a layer disposed subsequently, in particular a break due to a projecting edge of a common etched layer in the structuring of at least two layers attended with common masking when a thin film structure comprising laminated many layers is produced. SOLUTION: A layer 23 under a photosensitive layer 25 is etched in accordance with the masking of the photosensitive layer 25. In this case, under-etching under the making is induced, a thin film structure part, together with the photosensitive layer 25, is subjected to temp. treatment by which the photosensitive layer 25 flows along the edge parts of etched layers 26, 27 and is distributed so as to perfectly cover the edge parts and then the layer 23 is etched using appropriate photosensitive layer 25. |
