| 发明名称 |
Method of improved cavity BGA circuit package |
| 摘要 |
An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
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| 申请公布号 |
US6040631(A) |
申请公布日期 |
2000.03.21 |
| 申请号 |
US19990238872 |
申请日期 |
1999.01.27 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DIBBLE, ERIC P.;JOHNSON, ERIC A.;PHILLIPS, JR., RAYMOND A. |
| 分类号 |
H01L21/60;H01L21/58;H01L23/36;H01L23/373;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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