| 摘要 |
PROBLEM TO BE SOLVED: To easily execure copper plating free from voids in fine pores, grooves or the like with high efficiency without requiring special equipment, on a base material having fine pores or fine grooves, at first, by executing plating at low electric current in a short time, next increasing the electric current and executing plating to a prescribed film thickness. SOLUTION: The surface of a base material in which wiring grooves composed of fine pores and/or fine grooves with different sizes, widths and depths are formed is plated, at first, at low current density in a short time, e.g. at the average cathode current density of 0.03 to 0.5 A/dm2 for 10 sec to 10 min. In this way, the metal is precipitated to the inside of the wiring grooves. Next, the electric current is increased, and plating is executed, e.g. at the current density of about 0.5 to 10 A/dm2 to a prescribed thickness. In this way, the metal is precipitated without the clogging in the vicinities of the inlets of the pores and grooves, and the wiring grooves are filled with copper with hardly generating voids. Thus, the wiring pattern on the substrate obtd. thereby shows good copper plating volume resistivity.
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