| 摘要 |
PROBLEM TO BE SOLVED: To prevent a tendency of the mechanical properties of the obtd. film to directional dependency by arranging a planar body on the space between a target and the substrate carrying face and executing film formation while the oblique incidence along the substrate carrying direction of the sputtering particles from the target is prevented. SOLUTION: A target 1 is sputtered by plasma, the formed sputtering particles 3 are introduced into the surface of a substrate 4 in the process of carrying in the direction of the arrow 6 via a carrying roll 5, and a film is formed thereon. In this inline type sputtering method, the space between the target 1 and the substrate carrying face is provided with a planar body 2 for preventing the oblique incidence along the substrate carrying direction 6 of the sputtering particles 3 from the target 1. As to this planar body 2, preferably, the intervals are controlled to a degree of at least the trisection of the length in the longitudinal direction of the target 1, the length is controlled to about 1/2 of the distance between the target 1 and the substrate carrying face, the material is composed of metal, and water cooling is possible according to need.
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