| 摘要 |
PROBLEM TO BE SOLVED: To enhance the efficiency of the process for mounting surface-mount- devices by reducing the interrupting time of the surface-mount-device mounting operation due to the movement of a movable stage on which printed boards are placed. SOLUTION: In a chip mounter which is moved among a receiving position at which printed boards are received from a conveying member for supplying the boards on which chips as surface-mount-device are mounted, a part mounting position for mounting the chips, and a delivery position at which chip-loaded boards 6 are delivered to the conveying member, a pair of XY stages 10, 20 structured so that they can move between the receiving position and the part mounting position without interfering with each other, is provided. The XY stages 10, 20 are made up of, for example, mounting tables 11, 21 and driven parts 12, 22 driven so as to move parallel to the mounting faces of the mounting tables 11, 21, and elevating/lowering arms 13, 23 for elevating and lowering the mounting tables 11, 21 in relation to the driven parts 12, 22. |
