发明名称 Modular electronic enclosure having rotational molded plastic interlocking components
摘要 A modular enclosure includes multiple interlocking molded plastic components and panels to form an exterior structure for the enclosure. The exterior structure provides a protective and aesthetic housing which encloses and covers an interior enclosure housing electronic and mechanical equipment. The exterior interlocking components may be fabricated of plastic utilizing rotationally molding techniques to provide a hollow wall design resulting in structural rigidity and strength to the various external parts and components of the enclosure. The modularity of the present enclosure allows for easy replacement of exterior components without affecting operation of the equipment housed inside the enclosure.
申请公布号 US6039414(A) 申请公布日期 2000.03.21
申请号 US19980209693 申请日期 1998.12.11
申请人 ALCATEL USA SOURCING, L.P. 发明人 MELANE, MARCUS L.;PISTERZI, MICHAEL J.;MILLS, EDWARD G.;HARGROVES, CURTIS L.
分类号 H05K7/18;(IPC1-7):A47B45/00 主分类号 H05K7/18
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