发明名称 CHIP-TYPE THERMISTOR AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a highly precise and reliable chip-type thermistor and a method for manufacturing a chip-type thermistor with satisfactory workability, operability, and productivity. SOLUTION: A thermistor layer 2 is connected through a glass layer with an insulating substrate 1, and the two side faces and upper face of the thermistor layer 2 are coated with a glass layer 4, and external electrodes 6A and 6B are formed on the both edge faces in this chip-type thermistor 10A. In this case, a thermistor wafer is connected through a glass layer with the plate face of a thin plate-shaped insulating substrate, and a groove reaching from the thermistor wafer side to the insulating substrate is formed, and the upper face of the thermistor wafer and the groove are coated and filled with glass. Then, this is cut in the direction of the groove and in a direction orthogonally crossing the direction of the groove so that a chip can be obtained, and outside electrodes are formed on the both edge faces of this chip. Thus a chip-type themistor can be manufactured.</p>
申请公布号 JP2000082607(A) 申请公布日期 2000.03.21
申请号 JP19980251204 申请日期 1998.09.04
申请人 MITSUBISHI MATERIALS CORP 发明人 HIGUCHI YOSHIHIRO;YOTSUMOTO KOJI
分类号 H01C17/06;H01C7/04;(IPC1-7):H01C7/04 主分类号 H01C17/06
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