SUBSTRATE CHUCK, ALIGNER, MANUFACTURE OF DEVICE, SUBSTRATE CONVEYING SYSTEM AND METHOD FOR CONVEYING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To move a wafer while sucking the wafer to a wafer chuck by detachably sucking and holding the wafer to and at the chuck by negative pressure, supplying negative pressure from a stage at the time of holding the chuck at a stage, and supplying negative pressure from a conveying mechanism at the time of conveying. SOLUTION: A wafer chuck 3 vacuum sucks and holds a stage support surface 38 to a chuck support surface 41 on a wafer chuck support stage. A pipeline 42 is constituted as a wafer suction air piping system at the support stage independently from a chuck suction air piping system, to communicate a hose 10 connected to a vacuum unit with a stage side vacuum pipeline 33a of the wafer chuck. Since negative pressure is given to the wafer chuck via the support stage or a hand mechanism and hence the hose may not be drawn during conveying, the degree of freedoms of designing an apparatus is increased. Since the hose is not entangled, a trouble such as drop or the like of the wafer is reduced.