发明名称 |
MOLD ASSEMBLY FOR MOLDING THERMOPLASTIC RESIN AND PRODUCTION OF HOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold assembly for molding a thermoplastic resin which can extend a gate part sealing time and a pressure holding period and improve the transfer properties of a surface constituting the cavity of a mold to a molding. SOLUTION: A mold assembly is equipped with a first mold part 11 and a second mold part 12 for forming a molding from a thermoplastic resin, a cavity insert 20 of 0.1-10 mm thickness which is installed in the first mold 11 and constitutes part of a cavity 13, and a gate part 14 which is opened to the cavity. The cavity insert 20 is made of a material of 2×10-2 cal/ cm.sec. deg.C or below in heat conductivity, and the gate part 14 is at least made of a material of 2×10-2 cal/cm.sec. deg.C or below in heat conductivity. |
申请公布号 |
JP2000079628(A) |
申请公布日期 |
2000.03.21 |
申请号 |
JP19980250167 |
申请日期 |
1998.09.03 |
申请人 |
MITSUBISHI ENGINEERING PLASTICS CORP |
发明人 |
TAWARA HISASHI;KANEISHI AKIMASA |
分类号 |
B29C33/38;B29C33/76;B29C45/26;B29C45/37;B29K101/12;(IPC1-7):B29C45/26 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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