发明名称 HEAT PUMP APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat pump apparatus capable of keeping excellent heat transfer performance of an evaporator without additionally providing a power section and improving a performance coefficient (COP). SOLUTION: A heat pump apparatus P1 is operated by including a compressor 1, a condenser 2, an expansion valve 3, and an evaporator 4, and by encapsulating a non-azeotropic mixture refrigerant. The evaporator 4 uses plate type heat exchangers longitudinally, and uses the non-azeotropic mixture refrigerant such that the refrigerant flows upward and a fluid for heat exchange (non- cooling fluid) flows downward. There is provided a refrigerant heat exchanger 5 on the heat pump apparatus P1 such that a liquid refrigerant at an inlet of the expansion valve 3 and a liquid gas binary refrigerant at an outlet of the evaporator 4 exchange heat. The heat pump apparatus P1 is operated such that dryness of the refrigerant at the outlet of the evaporator 4 is not more than 0.95, and dryness of the refrigerant at the inlet of the compressor 1 is not less than 1.0 including an overheating region.
申请公布号 JP2000081251(A) 申请公布日期 2000.03.21
申请号 JP19980251236 申请日期 1998.09.04
申请人 CHUBU ELECTRIC POWER CO INC 发明人 SAKURABA ICHIRO;WATANABE SUMIO
分类号 F25B1/00;(IPC1-7):F25B1/00 主分类号 F25B1/00
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