| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste composition having excellent reliance on electric connections and equipped with a characteristic required of a via filling conductive paste composition. SOLUTION: No more than 5 pts.wt. solvent is contained compared with 100 pts.wt. in total of the components A-D, and the viscosity is made not more than 1000 Pa.s. the component A consists of 86-95 pts.wt. silver-covered copper particles of such a structure that copper particles whose mean particle size ranges from 1 to 10μm are coated with silver wherein the silver content as the coating relative to the total amount of the copper particles and silver coating is 0.5-20 wt.%, while the component B consists of 2-8 pts.wt. liquid-state epoxy resin having two or more epoxy radicals, and the component C consists of 2-8 pts.wt. phenol resin of resol type, and the component D consists of 0/5-5 pts.wt. hardening agent for epoxy resin.
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